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Lee Ratliff

Senior Principal Analyst, Connectivity & IoT

Country USA

Experience 12+ years

Lee Ratliff

Lee Ratliff is a connectivity and communications analyst responsible for directing the coverage of low-power wireless, broadband, and home networking semiconductors and technologies. His research focuses on examining what opportunities will emerge as data connectivity reaches the most isolated applications and unlocks captive value.


Before joining the company, Lee spent his career in the semiconductor industry in roles ranging from hardware and software design to product marketing and account management. At Texas Instruments, Lee specialized in connectivity technologies such as FireWire, USB, HDMI, and UWB. He has extensive knowledge in semiconductor design, fabrication, and operations; as well as in all phases of product development and in market dynamics driven by consumers and service providers.


Lee graduated from Texas Tech University in Lubbock, Texas, with a Bachelor of Science degree in electrical engineering.

 

Events Lee is speaking at

29 Apr 2020

Webinar

WEBINAR - Opportunities for Voice and Audio Streaming Over Bluetooth Low Energy (BLE)

Presenters:
  • Lee Ratliff

13 May 2020

Webinar

WEBINAR - IoT connectivity: Wi-Fi vs. Bluetooth vs. everything else

Presenters:
  • Yogita Kanesin
  • Lee Ratliff

Analyst Articles

  • All Categories
  • Insight
All Categories
  • CHIP standard is a turning point for the smart home

    Internet of Things

    CHIP standard is a turning point for the smart home

    The goal of the Connected Home over IP (CHIP) project is to create an application-layer interoperability protocol built on top of existing native-IP connectivity standards, such as Wi-Fi, Bluetooth, and Thread.